Vienna Stock Exchange News

HP & more dividends on the global market - ex date 06/13/2023

In the market segment global market dividends of HP and more international blue chips will be paid out – dividend ex date 13 June 2023:

Instrument
ISIN
DividendEx dayRecord datePayment day
BYD CO LTD-H
CNE100000296
1.142
CNY
06/13/202306/14/202308/31/2023
TELEFONICA SA
ES0178430E18
0.15
EUR
06/13/202306/14/202306/15/2023
NXP SEMICONDUCTORS NV
NL0009538784
1.014
USD
06/13/202306/14/202307/06/2023
HP INC
US40434L1052
0.2625
USD
06/13/202306/14/202307/05/2023
LAM RESEARCH CORP
US5128071082
1.725
USD
06/13/202306/14/202307/05/2023


Tip – Price data: All international securities in the global market

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Price Information

BYD CO LTD-H
TELEFONICA SA
NXP SEMICONDUCTORS NV
HP INC
US5128071082